Cree's behavior-based and temperature-dependent SPICE model delivers accurate simulation results without compromising speed and includes self-heating and transient thermal capabilities. SiC MOSFETs have significantly different characteristics than silicon devices, and thus require SiC-specific models for accurate circuit simulations. To take full advantage of all the benefits of SiC technology, power converters must be redesigned specifically for SiC devices. Using this new SPICE model, circuit designers can easily take advantage of SiC benefits, including switching frequencies up to 10 times higher than IGBT-based solutions, which enables smaller magnetic and capacitive elements and subsequently shrinks the overall size, weight, and cost of power electronics systems. Fast and accurate, the new model effectively demonstrates the benefits of Cree® SiC MOSFETs-including the new C2M0025120D device, which recently shattered the on-resistance barrier by delivering 1200V of blocking voltage with an on-resistance of only 25mWW-in circuit simulations.
has expanded its design-in support for the C2MT Series SiC MOSFET power devices with the release of a new SPICE model.